Samsung is reportedly preparing to distribute up to about $26.6 billion in AI‑linked semiconductor bonuses after a last‑minute union deal. Some chip workers’ payouts may average close to $400,000, though internal documents point to sharp disparities between memory and logic divisions, fueling labor tensions.
SK hynix unveiled a new “iHBM” thermal architecture for next‑generation high‑bandwidth memory, integrating cooling elements inside the HBM interface to reduce thermal resistance and target AI‑heavy data‑center workloads.
At Taiwan’s TSMC, employees are reported to be angry over proposed bonus changes, with talk of strikes and unionization. The company is considering trimming payouts to support heavy capital spending, despite record AI‑driven revenues.